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Michel Schimpf

michel.schimpf@gmail.com

Education

University of Cambridge

PhD Student: LLM Assistants for Behavior Change (10.2023 - present)

  • Accepted for a PhD with a Scholarship from the Cambridge Trust, Member of Jesus College

Visiting Researcher: AI and VR in Manufacturing Education (10.2022 – 06.2023)

  • Working on a patent for an augmented reality (AR) feature I developed using object detection
  • Incoming Co-Author for a book on Artificial Intelligence in Education that will be published by Springer
  • Developed AR applications for 3D printer maintenance and manufacturing assembly with Unity on HoloLens2

Technical University of Munich

(10.2018 – 10.2022)

Bachelor of Computer Science (Minor: Psychology at Ludwig Maximilians University) | GPA: 1.80/5

  • Notable courses: Advanced System Programming in Rust and C, Seminar: Data Mining
  • Bachelor thesis on deep reinforcement learning applied to robotics at the Human Brain Project | grade: 1.0/5
  • Awarded twice for the German National Scholarship for social engagement and outstanding performance

Foundation of the German Economy (SDW)

(10.2019 – 10.2020)

  • My startup Techdalo got support by 'Herausforderung Unternehmertum' with 15.000€ and McKinsey coaches
  • Participated in workshops such as leadership, project management, sales, and business plan development

Wilhelm Gymnasium Hamburg

(09.2010 – 06.2018)

  • Abitur (general higher education entrance qualification) | Graduation GPA: 1.1/6 (best: 1.0)
  • Participated in the volunteering, law, and debating clubs, was awarded for outstanding achievements in physics
  • Selected as one of 20 students from all high school students in Hamburg by the chamber of commerce to participate in classes in economics, communications, and ethics every other Saturday for two years

Professional Experience

Co-Founder at wahl.chat

(11.2024 – present)

  • Launched a new startup focused on innovative communication solutions
  • Achieved 150k users and generated 20k in revenue
  • Featured in over 30 news outlets

Machine Learning Engineer at Aaron.ai

(06.2023 – 04.2024)

  • Aaron.ai is one of the leading AI Startups in the German medical space, now acquired by DoctorLib
  • Developed an AI assistant for doctor practices using LLMs, Vector Databases, Python, Langchain, and AWS

Analyst at Venture Capital Fund Senovo

(04.2022 – 09.2022)

  • Senovo is a venture capital fund focusing on early-stage B2B SaaS startups
  • Sourced new deals, worked on the due diligence processes, and built a tool to optimize outbound deal flow

Co-Founder and Project Manager at Techdalo

(09.2019 – 05.2022)

  • Techdalo teaches Colombian students programming skills and helps them find jobs to break the poverty cycle
  • Built and led a team of 10 motivated students and pitched Techdalo on many occasions to acquire more than 30.000 euros in funding from companies like Google and Celonis
  • Successfully placed the first students at a Colombian tech company and passed on the project to a new leader

Intern Software Development at BMW

(10.2020 – 04.2021)

  • Implemented cloud-native middleware microservices with AWS Lambda, Node.js, Java, REST, and GraphQL, which decreased costs by over 90% for the services and are used as an example for further cloud migration
  • Implemented a tool that automates the notification of server outages using Node.js, React.js, and REST

Intern M&A Support at Möhrle Happ Luther

(07.2018 – 10.2018)

  • Created financial fact books, credit quality and market analysis, as well as investor research for clients
  • Prepared a client workshop on 'How do I optimize the sale of my company?'

Publications

  • Zuercher, P.-D., Schimpf, M., Tadeja, S., & Bohne, T. (in press). Educating manufacturing operators by extending reality with AI. In Artificial Intelligence in Education: The Intersection of Technology and Pedagogy. Springer Nature.
  • Pietschmann, Schimpf, M., Chen, Z., Pfister, H., & Bohne, T. (2024). Enhancing user performance and human factors through visual guidance in AR assembly tasks. In Proceedings of IEEE VIS 2024. IEEE.